Desktop XRF EDX2000A Automatic Micro-area Film Thickness Analyzer EDX Spectrometer

EDX2000A Automatic Micro-area Film Thickness Analyzer is a top-illuminate film  thickness tester specially developed by Drawell, which best exemplifies its multiple years of layer film thickness measurement technology. Compared with the traditional coating thickness analyzer, it not only performs more excellently on the conventional plating, but also better meets the needs of non-contact micro-area coating thickness testing in industries such as semiconductor, chip and PCB. The instrument outlook is elegant with simple touch.Through automatic three-dimensional movement of platform along X,Y and Z-axis, dual laser positioning and security protection system, it can realize rapid focusing and accurate analysis of various simple and complex samples such as planar, concave-convex, cornered and arc surfaces.

Application Fields of Desktop XRF EDX 2000A

  1. Electroplating Industry
  2. Magnetic Materials
  3. Electrical Equipment
  4. Electronic Communication
  5. New Energy for Aerospace
  6. Precious Metal Electroplating
  7. Automobile Manufacturing  
  8. Hardware and Sanitary Ware
  9. Universities and Research Institutes
Desktop XRF EDX 2000A Application Field

Features of Desktop XRF EDX 2000A

Ultra-high Hardware Configuration

Ultra-high Hardware Configuration
Au-Ni-Cu spectrum comparison
Au-Ni-Cu spectrum comparison

The imported high-resolution Fast-SDD detector is adopted, with a resolution of up to 140eV, which can accurately analyze the characteristic signals of each element.It displays great advantages at the detection of complex substrates and multi-layer complex coatings.

High-precision automatic X, Y and Z three-dimensional movement can more accurately and quickly complete the positioning of test points on small irregular shapes (such as arcs, arches, threads, spherical surfaces, etc.).

Design Highlights

  • The top-illumination design has more adaptability in detection of special-shaped micro-samples.
  • With brand new optical path and shorter optical passage the signal acquisition efficiency is increased by more than 2 times when compared with the traditional optical path.
  • The variable-focus high-precision camera, coupled with the distance correction system, can not only adapt to micro.products, but also meet detection requirements for steps deep grooves and countersunk samples.
  • Programmable multi-point detection is supported to automatically complete the multi-point detection of a number of samples, which greatly improves the efficiency of sample detection.
  • With its in-built data correction system, you will never have to worry about sudden data changes.
Design Highlights

Software Interface

  • Humanized software interface makes the operation more convenient.
  • The Chinese notes of the curve make your work easier to start.
  • The real-time monitoring of the functions of instrument hard ware makes you ruse more assured.
Software Interface

Specifications of Desktop XRF EDX 2000A

Measurable range of coating3Li~92U
Element detection range13AI~92U
Number of elements to bedetected simultaneously24 elements, and more than five coatings can be analyzed at the same time
Detection limit  The thinnest metal coating can reach 0.005μm
Thickness rangeAnalysis coating thickness is generally within 50μm(variable for different materials)
Standard deviation of thicknessRSD<3%
Content test range0.1%–99.99%
Content detection accuracy0.5%
Content stabilityThe repeatability of multiple measurements can reach 0.5%
Detection time  5-40 seconds
Lifting range of Z-axis of platform0~140mm
Detector and resolution25mm²Be window Fast- SDD semiconductor detector with resolution140±5eV
Multichannl analyzerDMCA digital multi-channel analysis technology with 4096 channels
CollimatorOptional 0.1*0.3mm,φ0.2mm,φ0.3mm,φ0.5mm and other apertures
Minimum test area0.02mm²
Sample observationEquipped with CCD colorful camera, the image can be magnified up to 25 times, which can realize clear positioning of tiny samples
Sample moving platformFull-automatic high-precision multi-point TEST XY mobile platform
FocusLaser adjustment of height with variable camera focusing
Analytical methodEnergy Dispersive X-ray Fluorescence Analysis Method combining FP and EC Methods
SecurityDual safety protection facilities:anti-collision laser detector and sensor detecting sample chamber cover opening and closing; There is no radiation in standby mode, the radiation level during operation is far lower than the international safety standard, and it is equipped with software interlocking device.
Dimensions485(W)×588(D)×505(H)mm
Sample chamber dimensions430(W)×400(D)×140(H)mm
Ambient temperature and humidity15℃~30℃,≤70%
Operating power supplyAC 220V±5V, it is recommended to configure AC purified regulated power supply
Instrument weight60kg